PCB
Print circuit board technology, OSP, solder splattered PCB,
Gold plated PCB, Chemical Gold PCB

OSP Solder splattered PCB Gold plated PCB Chemical Gold PCB
Processing Capability
| Materials | XPC / FR-1 / FR-4 / CEM-1 / CEM-3 |
| Layer Counts | Signal side/ Double side |
| Min. hole diameter | 0.3mm |
| Min. trace width | 0.25mm |
| Min. trace space | 0.25mm |
| Process | PCB wet process |
Equipment

OSP O/S Test Scrubbing Machine

Drilling Machine Developing Machine Wet Film Exposure Machine

Printing Machine CNC Routing Machine Punches